Technical specifications
Performance |
Standard loss |
低损 |
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Connector |
Mode |
Endface |
IL(max) (dB) |
RL(min) (dB) |
IL(max) (dB) |
RL(min) (dB) |
MPO/MTP |
SM |
12F/APC |
≤0.70 |
≥60 |
≤0.35 |
≥60 |
24F/APC |
≤0.75 |
≥60 |
≤0.35 |
≥60 |
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48F/APC |
≤0.75 |
≥60 |
|
|
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MM |
12F/PC |
≤0.50 |
≥20 |
≤0.35 |
≥20 |
|
24F/PC |
≤0.50 |
≥20 |
≤0.35 |
≥20 |
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48F/PC |
≤0.50 |
≥20 |
|
|
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LC/SC/FC/ST |
SM |
APC |
≤0.30 |
≥60 |
≤0.10 |
≥60 |
UPC |
≤0.20 |
≥50 |
≤0.10 |
≥50 |
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MM |
PC |
≤0.20 |
≥30 |
≤0.10 |
≥30 |
Note:
1.Test wavelength: SM@1310/1550nm,MM@850/1300nm;
2.Standard compliance: GR-326,GR-1435.
Mechanical properties |
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Item |
Standard range |
Ref standard |
|
△IL After 50 Matings |
MPO/MTP |
≤0.3dB |
GR-1435 |
△IL After 500 Matings |
LC/SC/FC/ST |
≤0.2dB |
IEC 61300-2-2 |
Minimum bending radius (dynamic) |
20*OD (cable OD) |
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Minimum bending radius (static) |
15*OD (cable OD) |
Environment condition |
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Item |
Standard range |
Ref standard |
Operation temperature |
-40~60°C |
IEC 61753-1 |
数据通信网络
光纤系统接入网
光纤存储区域网络
高密度机箱